Recent:
Novel Induced Offset Voltage Sensor in 12nm FinFET for Wear-Out Mechanism Characterization – IEEE IRPS 2024
I. Hill, M. Rendón and A. Ivanov, “A Novel Induced Offset Voltage Sensor for Separable Wear-Out Mechanism Characterization in a 12nm FinFET Process,” 2024 IEEE International Reliability Physics Symposium (IRPS), Grapevine, TX, USA, 2024, pp. 8A.4-1-8A.4-9, doi: 10.1109/IRPS48228.2024.10529475. keywords:
Enhanced Wear-Out Sensor Design in a 12nm Process for Separable Stress Regime Monitoring – IEEE VTS 2024
I. Hill, M. Rendón and A. Ivanov, “Enhanced Wear-Out Sensor Design in a 12nm Process for Separable Stress Regime Monitoring,” 2024 IEEE 42nd VLSI Test Symposium (VTS), Tempe, AZ, USA, 2024, pp. 1-7, doi: 10.1109/VTS60656.2024.10538772.
VioNet: A Hierarchical Detailed Routing Wire-short Violation Predictor Based on a Convolutional Neural Network – IEEE Design & Test – 2023
Y. Pan, Z. Zhou, S. A. Sheikholeslam and A. Ivanov, “VioNet: A Hierarchical Detailed Routing Wire-short Violation Predictor Based on a Convolutional Neural Network,” in IEEE Design & Test, doi: 10.1109/MDAT.2023.3314672.
Gerabaldi: A Temporal Simulator for Probabilistic IC Degradation and Failure Processes – IEEE VTS 2023
I. Hill and A. Ivanov, “Gerabaldi: A Temporal Simulator for Probabilistic IC Degradation and Failure Processes,” 2023 IEEE 41st VLSI Test Symposium (VTS), San Diego, CA, USA, 2023, pp. 1-7, doi: 10.1109/VTS56346.2023.10140111.
MEDUSA: A Multi-Resolution Machine Learning Congestion Estimation Method for 2D and 3D Global Routing – ACM TDAES – 2023
Z. Zhou, Y. Pan, G. G. F. Lemieux, and A. Ivanov, “MEDUSA: A Multi-Resolution Machine Learning Congestion Estimation Method for 2D and 3D Global Routing,” ACM Trans. Des. Autom. Electron. Syst. 28, 5, 2023, Article 73, doi: 10.1145/3590768.
Prediction of Thermally Accelerated Aging Process at 28nm – IEEE ETS 2022
P. A. Chanawala, I. Hill, S. A. Sheikholeslam and A. Ivanov, “Prediction of Thermally Accelerated Aging Process at 28nm,” 2022 IEEE European Test Symposium (ETS), Barcelona, Spain, 2022, pp. 1-2, doi: 10.1109/ETS54262.2022.9810415.
CMOS Reliability From Past to Future: A Survey of Requirements, Trends, and Prediction Methods – IEEE TDMR – 2021
I. Hill, P. Chanawala, R. Singh, S. A. Sheikholeslam and A. Ivanov, “CMOS Reliability From Past to Future: A Survey of Requirements, Trends, and Prediction Methods,” in IEEE Transactions on Device and Materials Reliability, vol. 22, no. 1, pp. 1-18, March 2022, doi: 10.1109/TDMR.2021.3131345.